Special Processes

In addition to all of the standard PCB specifications that we supply, Momentum also offer a number of additional processes that either optimise the performance of your circuit boards in relation to their intended use, or assist with multi-stage assembly processes to reduce labour and improve throughput efficiency.

These finishes include:

  • Selective ‘hard gold’ plating – Applications that require elevated levels of edge or surface connectivity with the use of gold fingers or connector pads.
  • Peelable solder resist – Momentum offer the best commercially available grade of peelable solder resist (Peters SD2955) for use in multi-pass thermal assembly processes. The peelable resist layer is used to cover areas that are not to be soldered during the solder wave process. This flexible layer can then be subsequently removed easily to leave pads, holes and solderable areas perfect condition for secondary assembly processes and component/connector insertion.
  • Filled vias – Momentum offer a comprehensive range of filled via options to match your requirement. Vias can be filled with either conductive metal paste for continuity, epoxy resin for use where the PCB forms an active barrier in intrinsically safe applications and copper filled to aid with temperature dissipation under components synonymous with the generation of localised heat on the board
  • Application specific finishes – Momentum offer speciality solder resists and aesthetic finishes that are designed to withstand the effects of ageing, varying temperature, humidity and resistance to tarnishing over prolonged periods.

Tell Momentum what you are trying to achieve and we will offer you the best solution to make your job easier.

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